E-268

Model: E-268
Agent A (main agent)
Color: colorless and transparent
Appearance: Liquid
Viscosity (cps/25 ℃): 10000-12000
Specific gravity: 1.17
B agent (hardener)
Color: colorless and transparent
Appearance: Liquid
Viscosity (cps/25 ℃): 12000-15000
Specific gravity: 1
Mix ratio: 1:01
Mixed viscosity: 11000-14000
Operation time: 3-5 minutes
Curing time: 30 minutes
Temperature resistance: -40 ℃~100 ℃

Product Features
1. Quick bonding, initial solidification in 3-5 minutes;
2. High hardness, impact resistance, and resistance to chemical media;
3. High shear and peel strength.

Suitable occasions
This product is a two-component, room temperature curing, epoxy structural adhesive suitable for electronic devices that require quick bonding and fixation, such as bonding, fixation, and sealing of electronic components, handicrafts, and gifts; For packaging and bonding between metals, ceramics, wood, glass, and hard plastics, it has excellent bonding strength and is not suitable for bonding products made of elastic or soft materials.

Instructions for use
Pre treatment: The substrate surface needs to remove coatings, oxide layers, oil, dust, release agents, and other surface contaminants.
Glue application: This product can be mixed with the main agent and curing agent by manual stirring or static mixing tube, and then evenly coated on the sealing area to be bonded.
Curing: This product can cure at room temperature and achieve the rated adhesive strength at 25 ℃. Heating can increase the curing speed.
Overflow glue: The uncured glue that overflows can be removed with ketone solvents.

Notes:
This product is not suitable for bonding in chlorine gas, pure oxygen, or oxygen rich environments, as well as strong oxidizing substances.
It is recommended to store in a cool and dry place at 8-28 ℃. Unused colloids should not be returned to their original packaging.