PUR Hot Melt Adhesive: The “Flexible Bonding Expert” in Electronics Manufacturing
As electronic device
Model: E-5106
Agent A (main agent)
Color: Black/White/Transparent
Appearance: Liquid
Viscosity (cps/25 ℃): 12000-15000
Specific gravity: 1.17
B agent (hardener)
Color: Transparent/Slightly Yellow/Black
Appearance: Liquid
Viscosity (cps/25 ℃): 8000-12000
No Documents
Phone: 18278134463 (Miss Liang)
Email: Jack@linkworldgroup.cn
Address: 5th Floor, Building 4, No. 459 Xiecao Road, Xiegang Town, Dongguan City
Have any Questions?
Feel free to Get in touch
Model: E-5106
Agent A (main agent)
Color: Black/White/Transparent
Appearance: Liquid
Viscosity (cps/25 ℃): 12000-15000
Specific gravity: 1.17
B agent (hardener)
Color: Transparent/Slightly Yellow/Black
Appearance: Liquid
Viscosity (cps/25 ℃): 8000-12000
Specific gravity: 1
Mix ratio: 1:01
Mixed viscosity (cps/25 ℃): 10000-11000
Operation time: 5-8 minutes
Curing time: 25-30 minutes
Temperature resistance: -40 ℃~120 ℃
Product Features
1. Rapid curing time, initial curing in 8 minutes;
2. Good toughness, resistant to mechanical vibration and thermal shock;
3. Excellent water resistance, chemical resistance, and oil resistance;
4. High shear and peel strength, with excellent adhesion to most substrates.
Suitable occasions
This product is a two-component, room temperature curing, low odor epoxy structural adhesive suitable for bonding metals, ceramics, glass, rubber, hard plastics, and most commonly used materials, especially in industrial settings with high impact, high peel strength, and low stress.
Instructions for use
Pre treatment: The substrate surface needs to remove coatings, oxide layers, oil, dust, release agents, and other surface contaminants.
Glue application: This product can be mixed with the main agent and curing agent by manual stirring or static mixing tube, and then evenly coated on the surface to be bonded.
Curing: This product can cure at room temperature and achieve the rated adhesive strength at 25 ℃. Heating can increase the curing speed.
Overflow glue: The uncured glue that overflows can be removed with ketone solvents.
Notes:
This product is not suitable for bonding in chlorine gas, pure oxygen, or oxygen rich environments, as well as strong oxidizing substances.
It is recommended to store in a cool and dry place at 8-28 ℃. Unused colloids should not be returned to their original packaging.
As electronic device