PUR Hot Melt Adhesive: The “Flexible Bonding Expert” in Electronics Manufacturing
As electronic device
Model: E-5214
Packaging: 30ml, 50ml
Color: Black
Viscosity: (mpa. s) 18000-19000
Density: (g/ml) 1.3
Operating time 25 ℃: 72h
Solid state: 60 ℃/30min, 80 ℃/15min
Shore hardness: 70D
Shear strength (MPa): 8.4
Long term resistance to high and low temperatures: -40-120 ℃
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Phone: 18278134463 (Miss Liang)
Email: Jack@linkworldgroup.cn
Address: 5th Floor, Building 4, No. 459 Xiecao Road, Xiegang Town, Dongguan City
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Feel free to Get in touch
Model: E-5214
Packaging: 30ml, 50ml
Color: Black
Viscosity: (mpa. s) 18000-19000
Density: (g/ml) 1.3
Operating time 25 ℃: 72h
Solid state: 60 ℃/30min, 80 ℃/15min
Shore hardness: 70D
Shear strength (MPa): 8.4
Long term resistance to high and low temperatures: -40-120 ℃
Product Features
The matrix has high stability and meets the long-term use requirements under thermal cycling conditions
High adhesive strength (especially suitable for bonding between different materials such as metal, ceramic, glass, plastic, wood, stone, etc.)
Low heat release during curing, low shrinkage rate, meeting the process requirements of precision components
Has excellent water resistance and acid alkali resistance
Suitable for
Widely used in memory cards, CCD/CMOS, LED lenses, miniature earphones, speakers, connector encapsulation and other devices
Instructions for use
Before use, ensure that the coating position of the components is clean, and that the surface is free of dust, oil, salt, flux, and other pollutants to prevent affecting their adhesion performance
Precautions
1. Before use, please thaw to room temperature. You can use a fan to accelerate the thawing process, but do not heat it. When removing the hose from the freezer, please do not hold the hose by hand and take it from the tail plug. When thawing, the hose should be upright and not lie horizontally. After thawing, use it all at once to avoid repeated thawing
2. Storage temperature:<-20 ℃, 6 months
As electronic device