PUR Hot Melt Adhesive: The “Flexible Bonding Expert” in Electronics Manufacturing
As electronic device
9676 hot melt adhesive
Color: milky white to semi transparent
Curing method: moisture curing
Viscosity: 4000-6000
Application temperature: 90-120 ℃
Storage temperature: 5 ℃ -25 ℃
Packaging specifications: 30ml, 300ml
Supporting equipment; 30ml/300ml syringe hot melt adhesive dispensing equipment
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Phone: 18278134463 (Miss Liang)
Email: Jack@linkworldgroup.cn
Address: 5th Floor, Building 4, No. 459 Xiecao Road, Xiegang Town, Dongguan City
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9676 hot melt adhesive
Color: milky white to semi transparent
Curing method: moisture curing
Viscosity: 4000-6000
Application temperature: 90-120 ℃
Storage temperature: 5 ℃ -25 ℃
Packaging specifications: 30ml, 300ml
Supporting equipment; 30ml/300ml syringe hot melt adhesive dispensing equipment
Typical application: mobile phone designated structural adhesive, with good anti-aging, drop, high temperature and high humidity test results. It also has good toughness and impact resistance on a very small bonding area.
Product Features
1. Good initial adhesion performance;
2. Moisture curing, fast curing speed, fine adhesive line;
3. High bonding strength and impact resistance;
4. Low cost, environmentally friendly (halogen-free, odorless, non-volatile)
Product Usage
Assembly of mobile phone cases, headphones, TWS headphones, tablets, fingerprint recognition, cameras and other products
Color: milky white to semi transparent
Curing method: moisture curing
Viscosity: 4000-6000
Application temperature: 90-120 ℃
Storage temperature: 5 ℃ -25 ℃
Packaging specifications: 30ml, 300ml
Supporting equipment; 30ml/300ml syringe hot melt adhesive dispensing equipment
As electronic device