PUR Hot Melt Adhesive: The “Flexible Bonding Expert” in Electronics Manufacturing
As electronic device
Epoxy adhesives are known for their strong bonding, chemical resistance, and durability. Available in one-component potting compounds or two-part AB systems, they provide excellent electrical insulation, thermal stability, and minimal shrinkage. Ideal for PCB protection, sensor encapsulation, and structural bonding.
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Model: E-106
Agent A (main agent)
Color: colorless and transparent
Appearance: Liquid
Viscosity (cps/25 ℃): 25000-45000
Specific gravity: 1.17
B agent (hardener)
Color: Light Yellow
Appearance: Liquid
Viscosity (cps/25 ℃): 2000-40000
Model: E-268
Agent A (main agent)
Color: colorless and transparent
Appearance: Liquid
Viscosity (cps/25 ℃): 10000-12000
Specific gravity: 1.17
B agent (hardener)
Color: colorless and transparent
Appearance: Liquid
Viscosity (cps/25 ℃): 12000-15000
Model: E-5105
Agent A (main agent)
Color: Black/White/Transparent
Appearance: Liquid
Viscosity (cps/25 ℃): 12000-15000
Specific gravity: 1.17
B agent (hardener)
Color: Transparent/Slightly Yellow/Black
Appearance: Liquid
Viscosity (cps/25 ℃): 8000-16000
Model: E-5106
Agent A (main agent)
Color: Black/White/Transparent
Appearance: Liquid
Viscosity (cps/25 ℃): 12000-15000
Specific gravity: 1.17
B agent (hardener)
Color: Transparent/Slightly Yellow/Black
Appearance: Liquid
Viscosity (cps/25 ℃): 8000-12000
Model: E-5107
Agent A (main agent)
Color: Black/White/Transparent
Appearance: Liquid
Viscosity (cps/25 ℃): 12000-15000
Specific gravity: 1.17
B agent (hardener)
Color: Transparent/Slightly Yellow/Black
Appearance: Liquid
Viscosity (cps/25 ℃): 5000-12000
Model: E-5214
Packaging: 30ml, 50ml
Color: Black
Viscosity: (mpa. s) 18000-19000
Density: (g/ml) 1.3
Operating time 25 ℃: 72h
Solid state: 60 ℃/30min, 80 ℃/15min
Shore hardness: 70D
Shear strength (MPa): 8.4
Long term resistance to high and low temperatures: -40-120 ℃
As electronic device