PUR Hot Melt Adhesive: The “Flexible Bonding Expert” in Electronics Manufacturing
As electronic device
Model: U-411
Packaging: 20g, 1kg
Color: Transparent
Viscosity: (mpa. s) 1500
Initial solid/full solid: 8S-40S/24h
Large filling gap (mm): 0.15
Shear strength (MPa): 20-30
High and low temperature resistance: -54-100 ℃
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Phone: 18278134463 (Miss Liang)
Email: Jack@linkworldgroup.cn
Address: 5th Floor, Building 4, No. 459 Xiecao Road, Xiegang Town, Dongguan City
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Model: U-411
Packaging: 20g, 1kg
Color: Transparent
Viscosity: (mpa. s) 1500
Initial solid/full solid: 8S-40S/24h
Large filling gap (mm): 0.15
Shear strength (MPa): 20-30
High and low temperature resistance: -54-100 ℃
Product Features
This product is designed for products with high requirements for appearance. After dispensing, the product can effectively reduce the phenomenon of white mist in a closed environment, and accelerate the curing of the glue to a non whitening level in a ventilated and low light environment.
Suitable for
Suitable for rapid bonding of most rubber, plastic, and metal materials, with excellent chemical/solvent resistance.
Instructions for use
1. Pre treatment: The surface of the material to be bonded should be clean and free of grease. Most surfaces do not have special pre-treatment, and pre-treatment is required for materials that are difficult to bond.
Precautions
1. This product is not suitable for use in pure oxygen and/or oxygen rich environments, and cannot be used as a sealing material for chlorine gas or other strongly oxidizing substances
2. Storage temperature 2 ℃ -8 ℃
Model: U-694
Packaging: 20g, 1kg
Color: Transparent
Viscosity (mpa. s): 10-150
Initial solid/full solid: 30S-60S/24h
Large filling gap (mm): 0.15
Shear strength (MPa): ≥ 15
Temperature range: -54 ℃~85 ℃
Model: U-490
Packaging: 20g, 1kg
Color: Transparent
Viscosity (mpa. s): 60-80
Initial solid/full solid: 30S-60S/24h
Large filling gap (mm): 0.15
Shear strength (MPa): ≥ 15
Temperature range: -54 ℃~85 ℃
Model: U-480
Packaging: 20g, 1kg
Color: Black
Viscosity (mpa. s): 50-80
Initial solid/full solid: 30S-60S/24h
Large filling gap (mm): 0.10
Shear strength (MPa): ≥ 15
Temperature range: -54 ℃~105 ℃
As electronic device