UV-4029

Model: UV-4029
Color: Transparent/Red
Curing method: UV curing
Initial solidification time: 6S
Hardness: 62D
Dielectric constant: 2.0-2.8
Packaging: 30ml, 50ml, 300ml, 1000ml

Product Features
Single component, medium viscosity, good surface dryness, 100% solvent-free thixotropy, easy to apply, excellent adhesive strength
Resistant to thermal shock, stable physical properties, low dielectric constant, and minimal impact on data transmission of connecting wires.

Suitable occasions
This product is suitable for protecting and fixing the soldering pins of communication server connection wires. In addition, this product exhibits good adhesion properties to most substrates, including glass, plastic, and most metals.

Instructions for use
Preprocessing: To achieve the desired bonding performance, the surface of the material being bonded should be clean and free of grease. When using liquid adhesives to bond crystalline or semi crystalline thermoplastic materials, the possibility of stress cracking should be checked. Glue application: This product should be dispensed using a glue dispenser with a black feeding tube. Curing: This product is sensitive to ultraviolet radiation and can be cured under ultraviolet/or visible light with sufficient intensity. The curing speed and final curing depth depend on the light intensity, spectral distribution of the light source, exposure time, and transparency of the adhesive material.